LDMOS Technology-based Airfast Power Multi-Chip Modules (MCMs) for High Output Power, Efficiency, and Extended Frequency Coverage
NXP Semiconductors has introducedAFSC5G26E38,2nd一代全面Airfast功率ulti-Chip Modules (MCMs) for supporting the evolution of5G mMIMO active antenna systemrequirements for cellular base stations. For accelerating the coverage of 5G, this new Airfast module family is designed based on NXP’s latestLDMOS technologythat offershigher output power, extended frequency coverage, and higher efficiency.
The AFSC5G26E38 modules deliver20% more output powercompared to the previous generation and feature a power-addedefficiency of 45%, which is four points higher than the previous generation for an overall reduction in the 5G network electricity consumption.
The AFSC5G26E38 can address the 5G C-band from 3.7 to 4.0 GHz and has a high level of integrations for removing complexity and eliminating multiple prototype passeswhile the reduction of component count helps improve yields and decrease qualification cycle time.The 2ndgeneration of the Airfast MCM series includes 10 devices that cover 5G frequency bands from2.3 to 4.0 GHz from 37 to 39 dBmaverage output power.
Features of AFSC5G26E38
- Frequency: 2.3 to 4.0GHz
- Advanced high-performance in-package Doherty
- Fully matched (50 ohm input/output, DC blocked)
- Covers all 5G active antenna frequencies
- Designed for low complexity analog or digital linearization systems
- RoHs compliant
Note:More technical Information can be found in theAFSC5G26F38 Datasheetlinked at the bottom of this page and on theRF power multi-chip modules (MCM)product page.
