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SMLD12WBN1W1-高可靠性1608尺寸的白芯片LED

SMLD12WBN1W1-高可靠性1608尺寸的白芯片LED
SMLD12WBN1W1-高可靠性1608尺寸的白芯片LED

罗姆宣布了SMLD12WBN1W,一个白色芯片以1608(1.6x0.8mm)的尺寸领先,可实现班级领先的可靠性。这个新软件包提供了卓越的固定性和较长的运营寿命,非常适合在工业和紧凑型消费设备中用于显示面板(例如温度控制显示)。

In recent years, the need to improve both design quality and visibility of industrial equipment has increased the use of White LEDs for numerical displays and visual indicators in these applications. High-reliability LEDs are required to guarantee no degradation in luminosity even with continuous operation for over 10 years. However, achieving this has not been possible until now due to the use of epoxy or silicone resins for molding of typical White chip LEDs. These types of material could not provide enough reliability to prevent degradation in luminosity or provide enough package strength to facilitate mounting on circuit boards.

Rohm已提供从红色到绿色不等的1608尺寸芯片LED,现在它为该产品范围添加了白色,以满足市场需求。采用了一种结合环氧树脂和硅树脂好处的新材料,这使得在如此小的包装中实现白芯片的类别可靠性成为可能。

ROHM的测试表明,SMLD12WBN1W在操作1,000小时后保持其光度的100%(@25°C,IF= 20mA)。与市场上可用的其他类似产品相比,这表示运营生活的20倍改善。其他测试表明,与使用硅树脂的产品相比,新材料的包装强度改善了25倍。这将有助于大大减少安装在电路板上时制造过程中故障的发生。

Rohm致力于继续开发高度可靠的LED,并加强其产品系列,同时着重于提高可用性。

SMLD12WBN1W优势

可用性:现在价钱:$ 0.41/PC

主要特征

1.在操作测试期间成功保持100%发光强度(25°C,IF= 20mA,1,000小时)

能量测试结果

传统上,红色和绿色发光二极管用于显示panels of industrial equipment are less prone to cause yellowing of the resin due to light energy. Therefore, luminosity degradation has not been regarded as a problem. Epoxy resins with high mold hardness are commonly adopted for compact molded type LEDs. However, in the case of LEDs with a short wavelength (λD<527nm) such as White, the resin may turn yellow due to the energy of the light.

为了解决这个问题,SMLD12WBN1W利用一种新材料用于密封树脂,该树脂在操作测试过程中保持100%的光度(25ºC,IF= 20mA,1,000小时)。这将导致大约。与市场上相同的相同产品显示在相同条件下显示的剩余光度相比,寿命长20倍。

2.比使用硅树脂的包装强度高25倍

成型强度测量结果

尽管可以通过采用硅树脂来改善光强度降解,但模制变得更容易从底物脱离。无法使用增强安装强度(例如将反射器添加到紧凑的LED)之类的措施,而对成型部分的损坏仍然是一个挑战。

The use of a new resin material improves the molding strength by 25x when compared to products using silicone resin even at high temperatures (Ta=150ºC). This minimizes defects during mounting on circuit boards, thus achieving superior mountability.

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