Ultra-Compact AEC-Q101 Qualified MOSFETs in 1.0 mm × 1.0 mm DFN1010 Package for High-Density Automotive Applications
ROHM has introduced theultra-compact AEC-Q101 qualified MOSFETs,namelyRV8C010UN, RV8L002SN, and BSS84X. With the best in classpackage size of 1mm2withautomotive-gradereliabilityand it is suitable to be used inhigh-density applicationssuch asADAS and automotive ECUs.
In the automotive parts, the automated optical inspection (AOI) is performed after mounting for better reliability, but with bottom electrode components the solder joint cannot be verified since the terminals are not visible. To overcome this issue ROHM has included或iginal Wettable Flank technologyto ensure an unprecedented side electrodeheight of 125μmin the 1.0 mm × 1.0 mm (DFN1010 packages) size.
Extremelyhigh solder mounting reliability is achieved during AOI in automotive systems that require high quality. The new bottom electrode packaging also provides breakthrough miniaturization and high heat dissipation (up to65% over SOT-23) making it suitable for ADAS and automotive ECUs featuring higher board densities.
The new MOSFETs are suitable for switching and reverse connection protection applications such as Autonomous driving control ECUs, car infotainments, Engine control ECUs, Drive recorders, andADAS applications.
Features of RV8C010UN/ RV8L002SN/ BSS84X
- Leadless ultra-small and exposed drain pad for excellent thermal conduction SMD plastic package (1.0×1.0×0.4 mm)
- Side wettable Flanks for automated optical solder inspection (AOI). Tin-plated 100% solderable side pads guarantees Min.125 µm
- AEC-Q101 qualified
- ESD protection up to 2kV (HBM)
- Very fast switching
Note:More technical information can be found in theRV8L002SN DatasheetLinked at the bottom of this page and on the respective product pages ofRV8C010UN,RV8L002SN, andBSS84X.
