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u-blox M2-JODY-W3 Card
u-blox M2-JODY-W3 Card

M.2 Cards with Wi-Fi and Bluetooth Modules for Wireless Connectivity Options

U-Blox推出了一组Wi-Fi 5,Wi-Fi 6和蓝牙扩展卡,它们插入NXP半导体的I.MX处理器评估套件中。
FinFET Technology-Based Automotive Processors
FinFET Technology-Based Automotive Processors

High Performing 16nm FinFET Technology-Based New Automotive Processors Released for Radar and Vehicle Networking

Continuing to deliver the improved performance and rigorous automotive process qualifications to deliver safe next-generation computing power, NXP Semiconductors has announced the release of two new advanced processors,
Ultra-Low IQ PMIC to Power NXP iMX8M
Ultra-Low IQ PMIC to Power NXP iMX8M

Ultra-Low IQ PMIC Powers iMX8M Nano for Delivering High Performance in Embedded Artists Industrial Control Boards

ROHM Semiconductors has announced that Embedded Artists is using the BD71847AMWV, a highly integrated PMIC from ROHM along with NXP’s i.MX 8M Nano processor on its iMX8M Nano uCOM board.
CW641无线频段下6 e soc
CW641无线频段下6 e soc

New Wi-Fi 6 devices use Wi-Fi 6E Tri-Band Chipset for Increased Capacity, Reliability, and Improved Latency in Access Devices

NXP Semiconductors is laying the foundation for a new era of Wi-Fi 6 devices that operate in the 6GHz band with the help of the CW641 WiFi 6E Tri-Band System-on-chip (SoC). The ne
BlueBox 3.0 Development Platform from Maxim Integrated
BlueBox 3.0 Development Platform from Maxim Integrated

BlueBox 3.0 – Third Generation Development Platform for Safe Automotive High-Performance Computing

BlueBox 3.0, a new and expanded Automotive High-Performance Compute (AHPC) development platform from NXP Semiconductors allows the developers to accelerate the system development cycle and speed time t
Radar Sensor Chipset Solutions with 4D Imaging Radar
Radar Sensor Chipset Solutions with 4D Imaging Radar

带有4D成像雷达的新雷达传感器芯片组解决方案,以识别和分类周围的车辆

NXP Semiconductors has introduced new radar sensor chipset solutions that can surround vehicles in a 360-degree safety cocoon and allow the imaging radar to identify and classify
AFSC5G26E38 LDMOS Technology-based Airfast Power Multi-Chip Modules
LDMOS Technology-based Airfast Power Multi-Chip Modules

基于LDMOS技术的Airfast Power多芯片模块(MCMS),用于高输出功率,效率和扩展频率覆盖率

NXP Semiconductors has introduced AFSC5G26E38, 2nd generation comprehensive Airfast RF power Multi-Chip Modules (MCMs) for supporting the evolution of 5G mMIMO active antenna system
2x2 Wi-Fi 6 (802.11ax) Dual-Band + Bluetooth/BLE Solutions
2x2 Wi-Fi 6 (802.11ax) Dual-Band + Bluetooth/BLE Solutions

High Performance, Low Power, and Long Range Dual Band WiFi-6 and Bluetooth/BLE Solutions for Gaming, Audio, Industrial, and IoT Applications

NXP Semiconductors has announced the launch of 2x2 Wi-Fi 6 (802.11ax) Dual-Band + Bluetooth/BLE solutions for advanced gaming, audio, industrial, and IoT markets.
NXP S32G Vehicle Network Processor
NXP S32G Vehicle Network Processor

NXP S32G Vehicle Network Processor for advanced Edge to Cloud Analytics

NXP Semiconductors has introduced S32G vehicle network processors that enable the automotive industry to shift to higher-performance domain-based vehicle architectures and provide reduced software complexity and enhance security and safety. The p
Programmable Baseband Layerscape Processors for 5G Access Edge from NXP
Programmable Baseband Layerscape Processors for 5G Access Edge from NXP

Programmable Baseband Layerscape Processors for 5G Access Edge from NXP

NXP Semiconductor announced a new series of programmable processors of that are designed for the 5G access Edge applications.
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